2
12
18
28
12
12
1a
14
e
12
16
a
a
2
2
a
20
32
1a
2a
19
Faculty
61 16
19
1
49
2
2
1a
32
34
1b
1d
18
39
51
1d
2 29
1d
25
Andrew G. Richardson, Ph.D.
78
51
Research Assistant Professor of Neurosurgery
7
63
Department: Neurosurgery
4
1
23
1f
Graduate Group Affiliations
8
b
-
64
- Neuroscience e
1d
46
Contact information
6f
4
3
3
1d
6f
175A Stemmler Hall, 3450 Hamilton Walk
Philadelphia, PA 19104
26
Philadelphia, PA 19104
2e
Office: 215-746-4233
30
b1
12
30
18
Publications
23 a
3
2
29
4
b
1f
23 a
13
Education:
21 b B.S.E. 23 (Biomedical Engineering) c
38 Case Western Reserve University, 2000.
21 9 S.M. 23 (Mechanical Engineering) c
3e Massachusetts Institute of Technology, 2003.
21 a Ph.D. 23 (Biomedical Engineering) c
3e Massachusetts Institute of Technology, 2007.
c
3
3
3
3
92
Permanent link21 b B.S.E. 23 (Biomedical Engineering) c
38 Case Western Reserve University, 2000.
21 9 S.M. 23 (Mechanical Engineering) c
3e Massachusetts Institute of Technology, 2003.
21 a Ph.D. 23 (Biomedical Engineering) c
3e Massachusetts Institute of Technology, 2007.
c
2 29
21
1e
1d
24
76
e 29
27
Description of Research Expertise
48 Neuroengineering, Neuroscience, Brain-Machine Interfacese 29
23
15b Shankar S, Chen Y, Averbeck S, Hendricks Q, Murphy B, Ferleger B, Driscoll N, Shekhirev M, Takano H, Richardson A, Gogotsi Y, Vitale F: Transparent MXene microelectrode arrays for multimodal mapping of neural dynamics. Advanced Healthcare Materials 14(4): 2402576, Feb 2025.
201 Huang Y, Liu B, Hou Y, Xu J, You H, Hung A, Ghosh S, Liu E, Yang N, Ma J, Cai H, Kondrataviciute L, Deng Q, Kalia SK, Richardson AG, Hsieh P-H, Genov R, Liu X: A neuroprosthetic SoC with sensory feedback featuring frequency-splitting-based wireless power transfer with 200 Mb/s, 0.67 pJ/b backscatter data uplink and unsupervised multi-class spike sorting. IEEE International Solid-State Circuits Conference (ISSCC) 2025: 272-274, Feb 2025.
10a Ramayya AG, Buch V, Richardson A, Lucas T, Gold JI: Human response times are governed by dual anticipatory processes with distinct neural signatures. Communications Biology 8(1): 124, Jan 2025.
126 Du L, Ding Y, Hao H, Richardson AG, Zhao J, Van der Spiegel J, Aflatouni F, Lucas TH, Allen MG: Optical transparent packages for implantable devices. SPIE Photonics West 13323: 13, 2025 Notes: Oral presentation by Dr. Du.
11b Buch VP, Brandon C, Ramayya AG, Lucas TH, Richardson AG: Dichotomous frequency-dependent phase synchrony in the sensorimotor network characterizes simplistic movement. Scientific Reports 14(1): 11933, May 2024.
13a Hou Y, Zhu Y, Ji J, Richardson AG, Liu X: A wireless sensor-brain interface system for tracking and guiding animal behaviors through closed-loop neuromodulation in water mazes. IEEE Journal of Solid State Circuits 59(4): 1093-1109, Apr 2024.
173 Ding Y, Du L, Hao H, Mier TCE, Van der Spiegel J, Lucas TH, Aflatouni F, Richardson AG, Allen MG: A biocompatible glass-encapsulated triaxial force sensor for implantable tactile sensing applications. IEEE International Conference on Micro Electro Mechanical Systems (MEMS) 2024: 821-824, Feb 2024.
16b Hou Y, Zhu Y, Wu X, Li Y, Lucas TH, Richardson AG, Liu X: A multi-loop neuromodulation chipset network with frequency interleaving front-end and explainable AI for memory studies in freely behaving monkeys. IEEE International Solid-State Circuits Conference (ISSCC) 2024: 548-550, Feb 2024.
158 Hao H, Richardson AG, Ding Y, Du L, Allen MG, Van der Spiegel J, Aflatouni F: A 0.4V, 750nW, individually accessible wireless capacitive sensor interface IC for a tactile sensing network. IEEE International Solid-State Circuits Conference (ISSCC) 2024: 332-334, Feb 2024.
2c
7
1d
1f
Selected Publications
125 Lee W, Blade S, Hou Y, McIver A, Yang R, Liu X, Richardson AG: A miniature wireless device for closed-loop auditory sleep modulation. 12th International IEEE EMBS Conference on Neural Engineering (NER) 12: 1-4, Nov 2025.15b Shankar S, Chen Y, Averbeck S, Hendricks Q, Murphy B, Ferleger B, Driscoll N, Shekhirev M, Takano H, Richardson A, Gogotsi Y, Vitale F: Transparent MXene microelectrode arrays for multimodal mapping of neural dynamics. Advanced Healthcare Materials 14(4): 2402576, Feb 2025.
201 Huang Y, Liu B, Hou Y, Xu J, You H, Hung A, Ghosh S, Liu E, Yang N, Ma J, Cai H, Kondrataviciute L, Deng Q, Kalia SK, Richardson AG, Hsieh P-H, Genov R, Liu X: A neuroprosthetic SoC with sensory feedback featuring frequency-splitting-based wireless power transfer with 200 Mb/s, 0.67 pJ/b backscatter data uplink and unsupervised multi-class spike sorting. IEEE International Solid-State Circuits Conference (ISSCC) 2025: 272-274, Feb 2025.
10a Ramayya AG, Buch V, Richardson A, Lucas T, Gold JI: Human response times are governed by dual anticipatory processes with distinct neural signatures. Communications Biology 8(1): 124, Jan 2025.
126 Du L, Ding Y, Hao H, Richardson AG, Zhao J, Van der Spiegel J, Aflatouni F, Lucas TH, Allen MG: Optical transparent packages for implantable devices. SPIE Photonics West 13323: 13, 2025 Notes: Oral presentation by Dr. Du.
11b Buch VP, Brandon C, Ramayya AG, Lucas TH, Richardson AG: Dichotomous frequency-dependent phase synchrony in the sensorimotor network characterizes simplistic movement. Scientific Reports 14(1): 11933, May 2024.
13a Hou Y, Zhu Y, Ji J, Richardson AG, Liu X: A wireless sensor-brain interface system for tracking and guiding animal behaviors through closed-loop neuromodulation in water mazes. IEEE Journal of Solid State Circuits 59(4): 1093-1109, Apr 2024.
173 Ding Y, Du L, Hao H, Mier TCE, Van der Spiegel J, Lucas TH, Aflatouni F, Richardson AG, Allen MG: A biocompatible glass-encapsulated triaxial force sensor for implantable tactile sensing applications. IEEE International Conference on Micro Electro Mechanical Systems (MEMS) 2024: 821-824, Feb 2024.
16b Hou Y, Zhu Y, Wu X, Li Y, Lucas TH, Richardson AG, Liu X: A multi-loop neuromodulation chipset network with frequency interleaving front-end and explainable AI for memory studies in freely behaving monkeys. IEEE International Solid-State Circuits Conference (ISSCC) 2024: 548-550, Feb 2024.
158 Hao H, Richardson AG, Ding Y, Du L, Allen MG, Van der Spiegel J, Aflatouni F: A 0.4V, 750nW, individually accessible wireless capacitive sensor interface IC for a tactile sensing network. IEEE International Solid-State Circuits Conference (ISSCC) 2024: 332-334, Feb 2024.
2c
4d
22
22
7
10
a
a
2
2
19
18
10
22
10
11
c
5b © The Trustees of the University of Pennsylvania | Site best viewed a in a supported browser. | Site Design: 57 PMACS Web Team. 3 22
10
c
